Samsung to release '3D' memory modules with 50% greater density
The memory chips are stacked vertically
Computerworld - Samsung today announced a new 8GB dual inline memory module (DIMM) that stacks memory chips on top of each other, which increases the density of the memory by 50% compared to conventional DIMM technology.
Samsung's new registered or buffered (RDIMM) product is based on its current Green DDR3 DRAM and 40 nanometer (nm)-sized circuitry. The new memory module is aimed at the server and enterprise storage markets.
The three-dimensional (3D) chip stacking process is referred to in the memory industry as through silicon via (TSV). Samsung said the TSV process saves up to 40% of the power consumed by a conventional RDIMM. Using the TSV technology will greatly improve chip density in next-generation server systems, Samsung said, making it attractive for high-density, high-performance systems.
The TSV technology creates micron-sized holes through the chip silicon vertically instead of just horizontally, creating a much denser architecture. Samsung said it eventually plans to apply the TSV technology to memory built with 30nm-class and smaller circuitry.
"Our 40nm-class RDIMM ... marks the introduction of a more advanced, eco-friendly "Green Memory" product line-up utilizing 3D-TSV technology that is expected to enhance the leadership of Samsung and our allies in server and enterprise storage," Chang-Hyun Kim, senior vice president and fellow in Samsung's memory product planning and application engineering division, said in a statement.
The new RDIMM module has already been successfully tested by major Samsung system-making partners, the company said.
Samsung did not release any suggested pricing for the new RDIMM product, which is likely to be generally available to equipment manufacturers in the second half of 2011.
Lucas Mearian covers storage, disaster recovery and business continuity, financial services infrastructure and health care IT for Computerworld. Follow Lucas on Twitter at @lucasmearian or subscribe to Lucas's RSS feed . His e-mail address is email@example.com.
Read more about Data Storage in Computerworld's Data Storage Topic Center.
- Data Warehouse Augmentation: The Queryable Data Store While organizations have, to date, been busy exploring and experimenting, they are now beginning to focus on using big data technologies to solve...
- Rebranded Quadmark revamps its IT solutions with Google Apps Switching to Google Apps halved Quadmark's IT admin costs while achieving 10% time savings per employee. The global consulting firm now spends 80%...
- CrashPlan PROe Security Because mobile laptops often are connected to unsecured networks, a very high standard of security is required to ensure privacy.
- Protecting Digitalized Assets in Healthcare Healthcare providers face an urgent, internal battle every day: security and compliance versus productivity and service. For most healthcare organizations, the fight is...
- Live Webcast LIVE EVENT: 5/7, The End of Data Protection As We Know It. Introducing a Next Generation Data Protection Architecture. Traditional backup is going away, but where does this leave end-users?
- LIVE EVENT: 5/7, The End of Data Protection As We Know It. Introducing a Next Generation Data Protection Architecture. Traditional backup is going away, but where does this leave end-users?
- Make or Break: New Auto Products Must Go To Market On Time This Webcast quantifies the value of time to market for the auto industry and highlights how Primavera Enterprise Portfolio Management can help organizations. All Data Storage White Papers | Webcasts