Qualcomm to pay Broadcom $891M in patent settlement
IDG News Service - Qualcomm Inc., the world's largest maker of mobile phone chips, agreed to pay chip designer Broadcom Corp. $891 million to settle a long running patent dispute and to end all courtroom proceedings.
The agreement ends litigation in the U.S., the European Union and South Korea and gives each company the right to use the other's patent portfolio for four years, they said in a statement.
Qualcomm will make its first payment of $200 million by the end of June.
The settlement ends a dispute in which Qualcomm had lost at least one court case and saw its market threatened by a U.S. International Trade Commission ban on the import of new mobile phones and PDAs in mid-2007 that contained disputed Qualcomm chips.
The companies said some of the terms of the settlement were not disclosed.
Reprinted with permission from
Story copyright 2009 International Data Group. All rights reserved.
Qualcomm
Additional Resources



White Papers & Webcasts
Southern Company
Download Now
Extending Client Refresh - 11 Steps to Maximize Savings
Register Now!
Defending Against the Storm
Download Now
Lower the Cost and Complexity of a Mobile Workforce through Automation
Download This Resource Now!
Share our Strength
Download Now
Managing Mobility: Improve Data Security, Compliance and Manageability
Download This Resource Now!
Consolidate Your Servers and Storage to Lower Costs with Oracle Database 11g
Register for this webcast!
Top 10 Things to Know about Data Protection
Download Now
The Commercialization of ITIL: Lessons Learned
Register for this event today!
